? semiconductor components industries, llc, 1999 december, 1999 rev. 3 1 publication order number: mc74VHC1G08/d
the mc74VHC1G08 is an advanced high speed cmos 2input and gate fabricated with silicon gate cmos technology. it achieves high speed operation similar to equivalent bipolar schottky ttl while maintaining cmos low power dissipation. the internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. the mc74VHC1G08 input structure provides protection when voltages up to 7v are applied, regardless of the supply voltage. this allows the mc74VHC1G08 to be used to interface 5v circuits to 3v circuits. ? high speed: t pd = 3.5ns (typ) at v cc = 5v ? low power dissipation: i cc = 2 m a (max) at t a = 25 c ? power down protection provided on inputs ? balanced propagation delays ? pin and function compatible with other standard logic families ? latchup performance exceeds 300ma ? esd performance: hbm > 2000v; mm > 200v, cdm > 1500v figure 1. 5lead sot353 pinout (top view) 5 1 2 4 3 vcc in b in a out y gnd logic symbol in a in b out y & sc88a / sot353 df suffix case 419a pin assignment 1 2 3 gnd in b in a http://onsemi.com pin 1 d = date code v2 d 4 5 vcc out y l l h h l h l h function table inputs output ab l l l h y marking diagram see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information
mc74VHC1G08 http://onsemi.com 2 maximum ratings* characteristics symbol value unit dc supply voltage v cc 0.5 to +7.0 v dc input voltage v in 0.5 to +7.0 v dc output voltage v cc = 0 high or low state v out 0.5 to 7.0 0.5 to v cc + 0.5 v input diode current i ik 20 ma output diode current (v out < gnd; v out > v cc ) i ok +20 ma dc output current, per pin i out +25 ma dc supply current, v cc and gnd i cc +50 ma power dissipation in still air, sc88a 2 p d 200 mw lead temperature, 1 mm from case for 10 s t l 260 c storage temperature t stg 65 to +150 c * maximum ratings are those values beyond which damage to the device may occur. exposure to these conditions or conditions bey ond those indicated may adversely affect device reliability. functional operation under absolutemaximumrated conditions is not implied. functional operation should be restricted to the recommended operating conditions. 2derating e sc88a package: 3 mw/ c from 65 to 125 c recommended operating conditions characteristics symbol min max unit dc supply voltage v cc 2.0 5.5 v dc input voltage v in 0.0 5.5 v dc output voltage v out 0.0 v cc v operating temperature range t a 55 +85 c input rise and fall time v cc = 3.3v 0.3v v cc = 5.0v 0.5v t r , t f 0 0 100 20 ns/v
mc74VHC1G08 http://onsemi.com 3 dc electrical characteristics v cc t a = 25 c t a 85 c t a 125 c symbol parameter test conditions (v) min typ max min max min max unit v ih minimum highlevel input voltage 2.0 3.0 4.5 5.5 1.5 2.1 3.15 3.85 1.5 2.1 3.15 3.85 1.5 2.1 3.15 3.85 v v il maximum lowlevel input voltage 2.0 3.0 4.5 5.5 0.5 0.9 1.35 1.65 0.5 0.9 1.35 1.65 0.5 0.9 1.35 1.65 v v oh minimum highlevel output voltage v in = v ih or v il v in = v ih or v il i oh = 50 m a 2.0 3.0 4.5 1.9 2.9 4.4 2.0 3.0 4.5 1.9 2.9 4.4 1.9 2.9 4.4 v v in = v ih or v il i oh = 4ma i oh = 8ma 3.0 4.5 2.58 3.94 2.48 3.80 2.34 3.66 v v ol maximum lowlevel output voltage v in = v ih or v il v in = v ih or v il i ol = 50 m a 2.0 3.0 4.5 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il i ol = 4ma i ol = 8ma 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 v i in maximum input leakage current v in = 5.5v or gnd 0 to 5.5 0.1 1.0 1.0 m a i cc maximum quiescent supply current v in = v cc or gnd 5.5 2.0 20 40 m a ????????????????????????????????? ????????????????????????????????? ac electrical characteristics (c load = 50 pf, input t r = t f = 3.0ns) ???? ???? ??????? ??????? ????????? ????????? ??????? ??????? t a = 25 c ????? ????? t a 85 c ????? ????? t a 125 c ?? ?? ???? ???? symbol ??????? ??????? parameter ????????? ????????? test conditions ??? ??? min ??? ??? typ ??? ??? max ??? ??? min ??? ??? max ??? ??? min ??? ??? max ?? ?? unit ???? ? ?? ? ???? t plh , t phl ??????? ? ????? ? ??????? maximum propogation delay, input a or b to y ????????? ? ??????? ? ????????? v cc = 3.0 0.3v c l = 15 pf c l = 50 pf ??? ? ? ? ??? ??? ? ? ? ??? 4.1 5.9 ??? ? ? ? ??? 8.8 12.3 ??? ? ? ? ??? ??? ? ? ? ??? 10.5 14.0 ??? ? ? ? ??? ??? ? ? ? ??? 12.5 16.5 ?? ?? ?? ns ???? ? ?? ? ???? ??????? ? ????? ? ??????? i npu t a or b t o y ????????? ? ??????? ? ????????? v cc = 5.0 0.5v c l = 15 pf c l = 50 pf ??? ? ? ? ??? ??? ? ? ? ??? 3.5 4.2 ??? ? ? ? ??? 5.9 7.9 ??? ? ? ? ??? ??? ? ? ? ??? 7.0 9.0 ??? ? ? ? ??? ??? ? ? ? ??? 9.0 11.0 ?? ?? ?? ???? ???? c in ??????? ??????? maximum input capacitance ????????? ????????? ??? ??? ??? ??? 5.5 ??? ??? 10 ??? ??? ??? ??? 10 ??? ??? ??? ??? 10 ?? ?? pf typical @ 25 c, v cc = 5.0v c pd power dissipation capacitance (note 1.) 11 pf 1. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the noload dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
mc74VHC1G08 http://onsemi.com 4 *includes all probe and jig capacitance c l * test point device under test output figure 2. switching waveforms figure 3. test circuit gnd 50% 50% v cc input a or b output y t phl t plh 50% v cc v ol v oh device ordering information device nomenclature device order number circuit indicator temp range identifier technology device function package suffix tape & reel suffix package type tape and reel size mc74VHC1G08dft1 mc 74 vhc1g 08 df t1 sc88a / sot353 7inch/3000 unit package dimensions sc88a / sot353 df suffix 5lead package case 419a01 issue b notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: mm. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h 0.10 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 v 0.30 0.40 0.012 0.016 b 0.2 (0.008) mm 123 4 5 a g v s d 5 pl h c n j k b 0.5 mm (min) 0.4 mm (min) 0.65 mm 0.65 mm 1.9 mm
mc74VHC1G08 http://onsemi.com 5 figure 4. carrier tape specifications d 1 for components 10 pitches cumulative tolerance on tape 0.2 mm ( 0.008o) 2.0 mm 1.2 mm and larger center lines of cavity embossment user direction of feed k 0 see note 2 p 0 p 2 d e f w b 0 + + + k t b 1 top cover tape p see note 2 a 0 for machine reference only including draft and radii concentric around b 0 r min. tape and components shall pass around radius aro without damage bending radius *top cover tape thickness (t 1 ) 0.10 mm (0.004o) max. embossed carrier embossment typical component cavity center line typical component center line maximum component rotation 10 camber (top view) allowable camber to be 1 mm/100 mm nonaccumulative over 250 mm 100 mm (3.937o) 1 mm (0.039o) max 250 mm (9.843o) 1 mm max tape embossed carrier dimensions (see notes 1 and 2) tape size b 1 max d d 1 e f k p p 0 p 2 r t w 8 mm 4.35 mm (0.171o) 1.5 +0.1/ 0.0 mm (0.059 +0.004/ 0.0o) 1.0 mm min (0.039o) 1.75 0.1 mm (0.069 0.004o) 3.5 0.5 mm (1.38 0.002o) 2.4 mm (0.094o) 4.0 0.10 mm (0.157 0.004o) 4.0 0.1 mm (0.156 0.004o) 2.0 0.1 mm (0.079 0.002o) 25 mm (0.98o) 0.3 0.05 mm (0.01 +0.0038/ 0.0002o) 8.0 0.3 mm (0.315 0.012o) 1. metric dimensions governenglish are in parentheses for reference only. 2. a 0 , b 0 , and k 0 are determined by component size. the clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. the component cannot rotate more than 10 within the determined cavity
mc74VHC1G08 http://onsemi.com 6 figure 5. reel dimensions 13.0 mm 0.2 mm (0.512o 0.008o) 1.5 mm min (0.06o) 50 mm min (1.969o) 20.2 mm min (0.795o) full radius t max g a reel dimensions tape size a max g t max 8 mm 330 mm (13o) 8.400 mm, +1.5 mm, 0.0 (0.33o, +0.059o, 0.00) 14.4 mm (0.56o) figure 6. reel winding direction direction of feed barcode label hole pocket
mc74VHC1G08 http://onsemi.com 7 tape trailer (connected to reel hub) no components 160 mm min tape leader no components 400 mm min components direction of feed cavity tape top tape figure 7. tape ends for finished goods figure 8. reel configuration user direction of feed sc88a/sot353 (5 pin) device at1o pin one towards sprocket hole
mc74VHC1G08 http://onsemi.com 8 usa/europe literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com fax response line *: 3036752167 8003443810 toll free usa/canada *to receive a fax of our publications n. america technical support : 8002829855 toll free usa/canada on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent r ights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into t he body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information asia/pacific : ldc for on semiconductor asia support phone : 3036752121 (tuefri 9:00am to 1:00pm, hong kong time) email : onlitasia@hibbertco.com japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1418549 phone : 81354878345 email : r14153@onsemi.com on semiconductor website: http://onsemi.com for additional information, please contact your local sales representative. mc74VHC1G08/d
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